The 20th "China Optics Valley" International Optoelectronics Expo will be held at the China Optics Valley Science and Technology Convention and Exhibition Center from May 15th to 17th. HGTech will showcase its laser intelligent manufacturing + AI equipment, intelligent manufacturing solutions, and AI optical module solutions at the expo.

I. 3 Laser Intelligent Manufacturing + AI Equipment

How powerful can AI-powered laser intelligent manufacturing equipment be? Come to HGTech's booth to find out!

From 5-Axis Excellence to 6-Axis Innovation: 6-Axis Laser Microhole Machining Equipment for Complex Surfaces

Tailored for key links in the engine manufacturing industry chain of the aviation, aerospace, and shipbuilding sectors, it fulfills the needs of laser drilling, cutting, and welding for complex curved components.

Microhole Precision, Trace-Free Perfection: TGV Glass Substrate Drilling Intelligent Equipment

Designed specifically for precision processing of brittle materials in the consumer electronics field, it is suitable for machining microholes such as camera holes, flash holes, and noise reduction holes.

From Points to Gold, Efficient Forming: SLM Precision Metal 3D Printing Intelligent Equipment

Applied in 3D printing of small metal parts in fields such as 3C electronics, medical implants, and mold manufacturing, it enables precise forming of complex geometric shapes.

II. N+ Intelligent Manufacturing Solutions

At this expo, HGTech will demonstrate how AI-empowered "smart factories" become more intelligent, greener, and more efficient through four key production scenarios: AI + scheduling, AI + sorting, AI + welding, and AI + logistics.

On-site, through "VR + digital twin" interaction, visitors can experience how the digital twin system integrated with AI technology makes production factors more "transparent" and factory management more efficient.

III. 3 AI Optical Modules

As computing power becomes the new oil, optical modules are no longer simple transmission media but have evolved into the "neural synapses" of AI systems, accelerating value leapfrogging in high-density computing power scenarios.

1.6T AEC/ACC Copper Cable Module: As a key connection component for data transmission, high-speed copper cables will effectively meet short-distance connection needs in high-density computing power scenarios, which is crucial for intelligent computing centers and supercomputing centers handling large-scale data and complex computing tasks.

3.2T Module Solution: Adopting silicon photonics chips integrated with new materials and combined with packaging designs using new materials and processes, the comprehensive bandwidth can reach 100GHz. The demonstrated PAM4 optical eye diagram performance meets the transmission index requirements of 400G per wavelength / 3.2T per channel.